Silicone Paste
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Dow Corning silicone solutions for LED packages are designed to meet the challenging needs of the LED market. Silicone products offer good compatibility with standard LED substrates and processing techniques. The Dow Corning product line contains gels, elastomers and resins. |
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Features • High optical transparency• Excellent UV resistance • Excellent thermal stability • Low moisture up-take • Low ionic content |
Benefits
• Well-suited for IR, visible or UV |
1.Encapsulants: Gel, Elastomer and Resin
Dow Corning provides both High RI and Normal RI OE
Series silicone encapsulants, which have outstanding light
transmittance across the application wavelengths of LEDs.
These encapsulants provide excellent stress relief, moisture
protection and UV resistance for LED chip sealing and
protection.
2.Lens Molding: Elastomer and Resin
Dow Corning provides the high RI resin material needed
for optical lens fabrication. These products are designed
with excellent injection and compression molding
characteristics.
3.Overmolding: Elastomer and Resin
Dow Corning® OE Series silicone encapsulants are
excellent candidates for the overmolding process, the leading-
edge process technology.
Material Properties of HRI Encapsulants 
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| NRI Encapsulants |
Dow Corning®
OE-6450 |
Dow Corning®
OE-6520 |
Dow Corning®
OE-6550 |
Dow Corning®
OE-6630 |
Dow Corning®
OE-6635 |
Dow Corning®
OE-6665 |
| As Supplied | ||||||
| Component | 2-part | 2-part | 2-part | 2-part | 2-part | 2-part |
| Mixing Ratio | 10:1 | 10:1 | 1:1 | 1:1 | 1:1 | 1:1 |
| Cure Condition, °C/hr | 150/1 | 125/0.5 | 80/1 | 150/1 | 150/1 | 150/1 |
| Viscosity, Pa·s | 2.1 | 5.4 | 0.5 | 0.35 | 3.4 | 1.5 |
| After Cure | ||||||
| Hardness, JIS A | - | - | - | 35 | 71 | 65 |
| Refractive Index | 1.42 | 1.41 | 1.41 | 1.40 | 1.41 | 1.41 |
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Transmittance, % @ 450 nm, 1 mm |
99 | 91.5 | 100 | 99 | 97 | 98 |
