Silver Conductive Paste
Over a decade of experience in manufacturing silver conductive paste,NEXTECK is sure to be the first choice for your sourcing need. We offer high quality product with competitive price in a prompt delivery.
Key Features of our Silver Conductive Paste: | Applications: |
1. Excellent dispensability. 2. Low bleed-out. 3. Low condensable volatiles. 4. Fast curing. 5. Slow drying. 6. Low water absorption. |
1. LED 2. Laser diodes 3. RF parts 4. High power MMICs 5. High power hybrids and modules 6. Metallic solder die attach |
1000 Hrs Life ( Recommended processing temperatures: 30 minutes @ 150oC ) | |||
Typical Characteristics of High Power Conductive Paste: | |||
Filler Type | Silver (Ag) | Storage Condition | Below 0oC |
Total Solid Content | 94.5±1% | Shelf Life | Approx. 3 months |
Viscosity at 25oC |
Typical 18,000 ± 2,000cps (Brookfield CP5@5rpm) Note: Customization upon request |
Package | 20 g/each,16 per box |
Resistivity (150 for 0.5 hrs) |
< 50 m/sq./mil |
Weight Lost (After Cure at 260oC) |
< 0.1% |
Thermal Conductivity (20~25oC) |
> 60 Watt/(moK) | Thermal Expansion | 20~40 ppm/oC |
Typical Characteristics of Low Power Conductive Paste | |||
Filler Type | Silver (Ag) |
Thermal Conductivity (20~25oC) |
> 60 Watt/(moK) |
Silver Content | 90±1% | Storage Condition | Below 5 |
Total Solid Content | 92.5±1% | Shelf Life | Approx. 3 months |
Viscosity at 25 |
18,000 ± 2,000cps (Brookfield CP5@5rpm) Note: Customization upon request |
Package | 20 g/each,16 per box |
Resistivity (150 for 0.5 hrs) |
< 50 m/sq./mil |
Weight Lost (After Cure at 260oC) |
< 0.1% |