Ti Substrate | Stainless Substrate | Pi Substrate
Stainless Substrate
Improved material for solar cell (DS9 Coil trial samples):
| Chemical Composition | |
| SUS430 | DS9 |
| C: 0.12max | C: 0.02max(0.006) |
| Si: 0.75max | Si: 0.5max(0.2) |
| Mn: 1.00max | Mn: 0.5max(0.2) |
| P: 0.040max | P: 0.04max(0.025) |
| S: 0.030max | S: 0.03max(0.005) |
| Ni: 0.60max | Cr: 7.0 ~ 9.9(9.4) |
| Cr: 16.00 ~ 18.00 | Cu: 1.0max(0.4) |
PI Substrate
Mechanical Properties
As mentioned previously, UPILEX-S demonstrates outstanding mechanical characteristics through a wide temperature range. UPILEX-S displays high tensile strength and modulus, and also features outstanding long-term heat resistance. Another advantage inherent in UPILEX-S unaffected, even by immersion in boiling water for long periods of time.
| Table-1 Mechanical Properties | ||||||||
| Properties | Unit | Typical Values |
Test Method |
|||||
| UPILEX-25S ( 25μm ) | UPILEX-75S ( 75μm ) | |||||||
| -269℃ | -196℃ | 25℃ | 300℃ | 25℃ | 200℃ | |||
| Tensile Strength ( MD ) | MPa | 735 | 647 | 520 | 294 | 363 | 275 |
ASTM D882 |
| Stress at 5% Elongation ( MD ) | MPa | - | - | 255 | 88 | 206 | 108 |
ASTM D882 |
| Elongation ( MD ) | % | 10 | 15 | 42 | 67 | 50 | 80 |
ASTM D882 |
| Tensile Modulus ( MD ) | MPa | - | - | 9121 | 3727 | 6963 | 3825 |
ASTM D882 |
| Tear Strength Initiation [ Graves ] ( MD ) | N | - | - | 226 | - | 294 | - |
ASTM D1004 |
| Tear Strength Propagation [ Elmendorf ] ( MD ) | N | - | - | 3.24 | - | 4.22 | - |
ASTM D1922 |
| Folding Endurance [ MIT ] | Cycles | - | - | >100,00 | - | >25,000 | - |
ASTM D2176 |
| Density | X103kg/m2 | - | - | 1.47 | - | 1.47 | - |
ASTM D1505 |
| Coefficient of Kinetic Friction ( film-to-film ) | - | - | - | 0.4 | - | 0.4 | - |
ASTM D1894 |
Electrical Properties
UPILEX-S exhibits excellent electrical characteristics over a wide range of temperatures and frequencies. Even at high temperatures, UPILEX-S shows remarkably slight deterioration in its elevtrical preperties.
| Table-2 Electrical Properties | |||||||
| Properties | Unit | Typical Values |
Test Conditions |
Test Method |
|||
| UPILEX-25S | UPILEX-75S | ||||||
| 25℃ | 200℃ | 25℃ | 200℃ | ||||
| Dielectric Strength | kv | 6.8 | 6.8 | 11 | 11 | 50Hz |
ASTM D149 |
| Dielectric Constsnt | - | 3.5 | 3.3 | 3.3 | 3.2 | 103Hz |
ASTM D150 |
| Dissipation Factor | - | 0.0013 | 0.0078 | 0.0036 | 0.0056 | 103Hz |
ASTM D150 |
| Volume Resisticity | Ω-m | 1015 | 1013 | 1014 | 1014 | DC100V |
ASTM D257 |
| Surface Resisticity | Ω | >1017 | 1015 | >1016 | 1015 | DC100V | ASTM |
Thermal Properties
UPILEX-S boasts the highest heat resistance of any plastic film currently availble. Its major features include smaller values in both heat shrinkage and thermal expansion coefficients, and self-extinguishing (UL94 VTM-0). This makes it ideal for use in FPC and TAB-tape substrates composed of mninute circuits.
| Table-3 Thermal Properties | ||||
| Properties | Typical Values | Test Conditions ( Test Method ) | ||
| UPILEX-25S | UPILEX-75S | |||
| Heat Shrinkage ( % ) | 0.1 | 0.01 | 200℃，2Hours JIS C2318 | |
|
Thermal Linear Expansion Coefficient ( ppm / K ) |
20~200℃ | 12 | 20 | Values determained by minute linear expansion Tester at 5℃ / min ，temperature increments |
| Melting Point ( ℃ ) | None |
|
||
| Specific Heat ( kg-K ) | 1.13 | Differential Scanning Calorimeter | ||
| Temperature Index ( ℃ ) | 290 | Heat Treatment : 20,000 Hours | ||
| Flammability | UL94 VTM.0 ( Execeeding 7.5μm ) | UL94 File No.48133 | ||
| Oxygen Index ( % ) | 66 | JIS K7201 | ||
| Thermal Conductivity ( W / ( m．K ) | 0.290 | Laser Flash Method | ||
Chemical-Resistant Properties
UPILEX-S is insoluble in all organic solvents, and is sufficiently resistant to virtually any chemicals, including inorganic acid and alkali solution and so forth. UPILEX-S retains its physical properties and superior dimensional stability even when exposed to chemicals.
| Table 4-1 Chemical Properties | |||||
| Properties | Typical Values [ 25μm Film ] ( % ) | Test Conditions | Test Method | ||
| Strength Retained | Elongation Retained | Modulus Retained | |||
|
Resistance to: 10% Sodium Hydroxide Glatial Aceric Acid WaterPH=1.0 PH=4.2 PH=8.9 PH=10.0 |
80 100 95 95 95 95 |
60 95 85 85 85 85 |
95 100 100 100 100 100 |
Immersion at 25℃ for 5days Immersion at 110℃ for 5 weeks Immersion at 100℃ for 2weeks Immersion at 100℃ for 2weeks Immersion at 100℃ for 2weeks Immersion at 100℃ for 4 days |
ASTM D882 |
| Water Absorption |
1.4% 0.8% |
Immersion in water at 23℃ for 24 hours Equilibrium at 60%RH 50℃ | ASTM D570 | ||
|
Gas Permeability Water Vapor Oxygen Carbon Dioxide |
1.7X10-3kg / m2 / 25μm 0.8X10-6m3 / m2 / 25μm 1.2X10-3m3 / m2 / 25μm |
At 38℃,90%RH for 24 hours } At 38℃,1 atm for 24 Hours |
ASTM E96 ASTM D1434 |
||