Dicing Tape
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
We Toyo Adtec consider needs of each user and choose appropriate tapes.
Feature 
● Various product line
● standard type (AD series)
● high-performance to difficult-to-adhere workpiece (GD series)
● excellent stability against elapsed deterioration (T series)
● high-performance to laser-dicing (F-90)
● Easy pick-up with excellent expandability
Specification
| Recommended Works | Part Number |
Base Film |
Color | Thickness (μm) | Adhesion Thickness (μm) | Adhesive Strength (N/20mm) | Probe Tack (N/20mm2) | Feature |
|---|---|---|---|---|---|---|---|---|
|
Si GaAs Other Semiconductor |
F-90MW | PO | MW | 90 | 10 | 1 | 1 | PVC-free type |
| T-80MW | PVC | 80 | 0.8 | 0.7 | Excellent temporal stability | |||
| T-80HW | 1.7 | 1 | ||||||
| T-120HW | 120 | 1.7 | 1 | |||||
| Thick Workpiece | 20GE-200 | LB | 200 | 2.7 | 2.9 | For thick workpiece |
*The above data is just for representing value, and not guaranteed value.
*Static type is lined up.
*Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
*Separator thickness is not included.
- UV Series -
A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.
Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
We Toyo Adtec consider needs of each user and choose appropriate tapes.
Part Number :
UDV - 80J / UDV - 100J / UHP - 110B
UHP - 0805MC / UHP - 1005M3
UHP - 110M3 / UHP - 1025M3
UHP - 1510M3 / UHP - 1525M3
USP - 1515M4 / USP - 1515MG
UDT - 1025MC / UDT - 1325D
UDT - 1915MC
Feature
● Excellent control to back-side chipping and chip fly-off.
● Excellent adhesiveness.
● Smooth peeling by UV.
● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.
Specification
|
Recommended Work I |
Si GaAs Other Semiconductor |
|||||
|---|---|---|---|---|---|---|
| Part Number |
UDV-80J |
UHP-110M3 |
||||
| Base film | PVC | PO | ||||
| Color | T | MW | ||||
| Thickness (μm) |
80 |
100 |
110 |
85 |
105 |
110 |
| Adhesion Thickness (μm) | 10 | 5 | 10 | |||
| Adhesive Strength (N/20mm) |
3.8(0.2) |
3.8(0.2) |
2.9(0.2) |
5.0(0.2) |
5.0(0.2) |
7.6(0.2) |
| Probe Tack (N/20mm2) |
2.1(0.05) |
2.1(0.05) |
2.7(0.05) |
1.7(0.05) |
2.7(0.05) |
3.9(0.05) |
| characteristic | Easy pickup | For less chipping | For small size chips | |||
|
Recommended Work II |
Package | ||||
|---|---|---|---|---|---|
| Part Number |
UHP-1510M3 |
USP-1515M4 |
USP-1515MG |
||
| Base film | PO | ||||
| Color | MW | ||||
| Thickness (μm) |
125 |
160 |
175 |
165 |
|
| Adhesion Thickness (μm) |
25 |
10 |
25 |
15 | |
| Adhesive Strength (N/20mm) |
12.0(0.2) |
6.5(0.2) |
13.5(0.2) |
14.5(0.2) |
15.0(0.2) |
| Probe Tack (N/20mm2) |
5.5(0.05) |
4.2(0.05) |
5.6(0.05) |
6.2(0.05) |
5.9(0.05) |
| characteristic |
For encapsulated workpiece For less backside burrs For less glue scratch-up on the chip side walls For less against residue onto a making area |
||||