Welcome To NEXTECK

NEXTECK GROUP

Our About Us

Nexteck's products and market focuses are Electronics, Semiconductors, Displays, Solar PV/Wind Power, AeroSpace and Military industrial. That is achieved through intense collaboration, passionate customer focus, thoughtful and disciplined execution, a tenacious commitment to continuous improvement and a relentless drive to win.Nexteck's innovative materials are used in many areas of both electronics and electrical engineering. During production we are always committed to meeting specific customer requirements.

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NEXTECK GROUP PACKAGING MATERIALS

Our Products

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Cover Tape

Excellent sealing performance for heat-seal type embossed carrier tapes. Offers good, steady peeling characteristics.

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Dicing Tape

Elegrip Dicing Tape used widely in silicon, GaAs semiconductors, encapsulated package substrates, ceramics & crystals.

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Thermo Sheet

THERMO SHEET EC is a SHEET material that USES carbon black to make it conductive.Our company has various grades of polystyrene and...

Product Features

Our Product

THERMO SHEET EC - Electrical conductivity with carbon black, PS & PC based grades available, 3 layers with stable electrical conductivity.
• THERMO FILM - Cover tape film, PS, PC, PEC, PVC. Excellent sealing for heat-seal embossed carrier tapes, good peeling characteristics.
• ELEGRIP TAPE (Back Grinding Tape) - Protect the circuit surface “r”, excellent adhesion to uneven wafer surfaces on the circuit side, effective control of particles.
• ELEGRIP TAPE (Dicing Tape) - Excellent control to back-side chipping fly-off, excellent over-time stability (T Series), excellent adhesiveness (shape-following properties), excellent expandability peeling.

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Company News

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Wafer Dicing: A Critical Step in Semiconductor Manufacturing
Blog 2024-09-27

Wafer dicing is a crucial process in the semiconductor packaging industry, used to separate silicon wafers into individual chips. This step is an essen...

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SEMICON Taiwan 2024
Blog 2024-09-05

SEMICON Taiwan 2024 has held exhibitions from September 4th to September 6th at Hall 1 and Hall 2 of Taipei Nangang Exhibition Center. SEMICON Taiwan 2...

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Scientists Develop Low-Cost Energy-Efficient Iron-Based Allo
Blog 2024-08-09

An international team of scientists from the National University of Science and Technology MISIS (NUST MISIS), Tianjin University (China), as well as f...

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