Wafer Dicing: A Critical Step in Semiconductor Manufacturing
Blog 2024-09-27Wafer dicing is a crucial process in the semiconductor packaging industry, used to separate silicon wafers into individual chips. This step is an essen...
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Nexteck's products and market focuses are Electronics, Semiconductors, Displays, Solar PV/Wind Power, AeroSpace and Military industrial. That is achieved through intense collaboration, passionate customer focus, thoughtful and disciplined execution, a tenacious commitment to continuous improvement and a relentless drive to win.Nexteck's innovative materials are used in many areas of both electronics and electrical engineering. During production we are always committed to meeting specific customer requirements.
Excellent sealing performance for heat-seal type embossed carrier tapes. Offers good, steady peeling characteristics.
Elegrip Dicing Tape used widely in silicon, GaAs semiconductors, encapsulated package substrates, ceramics & crystals.
THERMO SHEET EC is a SHEET material that USES carbon black to make it conductive.Our company has various grades of polystyrene and...
THERMO SHEET EC - Electrical conductivity with carbon black, PS & PC based grades available, 3 layers with stable electrical conductivity.
• THERMO FILM - Cover tape film, PS, PC, PEC, PVC. Excellent sealing for heat-seal embossed carrier tapes, good peeling characteristics.
• ELEGRIP TAPE (Back Grinding Tape) - Protect the circuit surface “r”, excellent adhesion to uneven wafer surfaces on the circuit side, effective control of particles.
• ELEGRIP TAPE (Dicing Tape) - Excellent control to back-side chipping fly-off, excellent over-time stability (T Series), excellent adhesiveness (shape-following properties), excellent expandability peeling.
Wafer dicing is a crucial process in the semiconductor packaging industry, used to separate silicon wafers into individual chips. This step is an essen...
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